Ceramic Forming Capabilities
Vast Ceramic Forming Capabilities to Solve Technical Challenges
CoorsTek uses more than a dozen forming technologies to form and shape technical ceramics, providing dimensional and density control. Our engineers consult with you to determine the optimal forming methods for your application — based upon material, size, production volume, cost considerations, and other critical requirements. Some of the forming methods we use include:
- Dry press
- Isostatic press
- Roll compaction
- Hot press
- Hot isostatic press (HIP)
- Extrusion and micro-extrusion
- Injection mold
- Ram press (jigger)
- Tape cast
- Pressure cast
- Thixotropic cast
- Gel cast
- Chemical vapor deposition (CVD)
Ceramic injection molding
Ceramic injection molding combines the benefits of advanced technical ceramics with cost-effective, volume production of complex, tight-tolerance components. CoorsTek has deep expertise in ceramic injection molding, with the capability to mold a variety of advanced ceramic materials for a broad range of applications.
Injection molding of ceramics eliminates the need for secondary operations normally required to produce complex geometrical shapes. The more complex the shape, the more advantageous injection molding will be over other fabrication methods.
For more information, visit our Ceramic Injection Molding page here.
Ceramic extrusion and Micro-extrusion
CoorsTek uses ceramic extrusion processes to create a variety of standard and customer ceramic tubes and rods in elongated form with a range of perimeter configurations from circular to trapezoidal. CoorsTek is also capable of micro-extruding rods with an outer diameter as small as 0.28 mm (0.011").
Visit the CoorsTek Tubes and Rods online store.
hot isostatic pressing
Hot isostatic pressing combines thermal sintering with pressure — a premium process for densifying components, generally reserved for applications requiring ultimate material properties. Typically, ceramic components are first sintered to make the ceramic impermeable, then gas-pressurized at the surface of the component.