Microelectronics
Custom Electronic Components • Electronic Substrates • RF & Microwave
Technical Ceramic Components for Microelectronic Applications
Ceramic microelectronic components are crucial for high-performance electronics in aerospace, automotive, communications, computers, medical devices, industrial equipment, and consumer appliances. CoorsTek, a leader in custom and standard thick-film and thin-film ceramic substrates, offers cost-effective, durable solutions for hybrid integrated circuits, surface mount devices, sensors, and other thick-film electronic applications. CoorsTek ceramics ensure reliable, long-term performance for various applications, enhancing the performance and reliability of your electronic devices across different environments.
Custom Electronic Components
CoorsTek offers a diverse range of technical ceramics that excel in electrical insulation, thermal management, and durability, including custom components like ceramic-to-metal feedthroughs and aluminum nitride (AlN) heat exchangers. Their products, such as ThermTile™ heat sinks and epoxy seal lids, are designed to enhance efficiency and reliability in electronic devices by combining high electrical resistivity with superior thermal conductivity and resistance to harsh conditions.
MICROELECTRONIC INSULATORS
Many technical ceramics are inherently strong electrical insulators. CoorsTek provides a wide range of electrical insulator components in various shapes, sizes, and form factors - providing high electrical resistivity, dielectric strength, and other application-specific requirements.
Aluminum Nitride Insulators
Aluminum Nitride (AlN) has a very high thermal conductivity, allowing this unique ceramic to spread and get rid of heat quickly. This allows electronic components to maintain cooler operating temperatures while still providing the excellent electrical insulation of ceramic insulators.
Feedthroughs
CoorsTek provides custom ceramic-to-metal feedthrough assemblies for passing energy or materials between the outside and inside of hermetically-sealed chambers. These feedthroughs combine electrical insulation with vacuum-tight performance - and are engineered to withstand harsh conditions like high or cryogenic temperatures, high pressure or vacuum, and aggressive chemicals.
power electronics
CoorsTek Use engineered technical ceramics for your power electronics to help manage heat load, increase efficiency, and improve reliability.
Heat Sinks
CoorsTek ThermTile™ ceramic heat sinks and electrical insulators are an optimum choice when thermal management is important — combining the benefits of strong ceramic tiles, good thermal conductivity, and phase-change materials to improve heat transfer from power electronics and other heat-generating devices.
Fuse Bodies
CoorsTek ceramic fuse bodies deliver robust dielectric strength, high resistivity, and durability for industrial and commercial-grade fuses.
Epoxy Lids
CoorsTek ceramic epoxy seal lids are prepared for B-stage epoxies with rapid cure cycles - delivering high-strength, moisture-resistant seals for electronic and pressure-sensitive devices. Our epoxy seal has excellent fillet formation characteristics, and the high post-cure thermal and moisture resistance needed for high-reliability electronic packages.
Heat Exchangers
CoorsTek aluminum nitride (AlN) heat exchangers, or cooling boxes, take advantage of high thermal conductivity, corrosion resistance, and electrical insulation to provide long-life, water-based active cooling.
Metallized Electronic Components
CoorsTek supplies custom metallized ceramic components and assemblies, with metal-to-ceramic joints of exceptional strength, durability, and hermeticity.
Electronic Substrates
CoorsTek is the leader in ceramic substrates for thin-film and thick-film electronics, providing over a dozen substrate types optimized for a variety of processes and applications. Applying our deep expertise in advanced technical ceramics, CoorsTek engineers ceramic materials and substrate processing specifically to the rigorous demands of today’s thin-film and thick-film technology.
thick-film electronic substrates
CoorsTek developed the standards for thick-film ceramic substrates and continues to provide economical yet durable substrates for hybrid integrated circuits, surface mount devices, sensors, and other thick-film electronics. We help you design a thick-film ceramic substrate tailored to your application.
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thin-film electronic substrates
CoorsTek is the leader in custom and standard thin-film ceramic substrates. Four thin-film substrate material options combine smooth surface finish, strong flexural strength, and consistent electrical properties. Contact CoorsTek to help you design a specific thin-film substrate for your application or download our Design Guide.
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RF & Microwave
CoorsTek specializes in advanced technical ceramics that deliver reliable, long-term performance in high-power RF and microwave applications. Our RF & microwave components are integral to systems used in medical imaging, airport scanning, and microwave gyrotrons, ensuring high power and frequency capabilities. For x-ray tubes and other demanding high-frequency applications like e-beam systems, CoorsTek provides custom technical ceramic components and brazed assemblies that meet stringent performance requirements. We collaborate closely with clients to design and manufacture custom microwave and RF components, offering solutions from rapid prototyping to large-scale production to address specific application needs effectively.
rf & microwave components
CoorsTek provides advanced ceramic components used in high-power, high-frequency systems such as medical imaging, airport scanning, and microwave gyrotrons.
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X-ray Tubes components
Technical ceramics are used to support x-ray imaging, e-beam, and other demanding high-frequency applications with custom components and brazed assemblies.
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custom microwave & RF components & assemblies
CoorsTek works with you to design and produce a wide range of advanced ceramic components and brazed assemblies for your specific microwave and RF applications — from rapid prototyping through volume production.