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Thick-Film Electronic Substrates

Ceramic Substrates for Thick-Film Electronics

Thick-Film Ceramic SubstratesCoorsTek developed the standards for thick-film ceramic substrates and continues to provide economical yet durable substrates for hybrid integrated circuits, surface mount devices, sensors, and other thick-film electronics. We help you design a thick-film ceramic substrate tailored to your application:

  • Material selection
  • Size & thickness
  • Tolerancing
  • Laser machining & scribing
  • Edge finishing
  • Inspection & special requirements

Why Ceramic Thick-Film Substrates?


Alumina is the material of choice for most thick-film ceramic substrates — delivering durable, cost-effective performance for hybrid electronic circuits with proven reliability. CoorsTek has engineered different grades, formulations, and thicknesses to provide an optimal fit for a variety of applications.  

Thin film substrates made with CoorsTek alumina for microelectronic applications.

Alumina Thick-Film Substrates

CoorsTek ADS-96R thick-film alumina substrates are the standard, particularly well suited for small-geometry, high-resistance circuitry — engineered to minimize resistivity variation and maximize aged adhesion.

Alumina thin-film substrates for microelectronic applications.

MidFilm® Substrates

CoorsTek MidFilm substrates are compatible with etchable inks and photo-formed systems — combining high flexural strength and thermal conductivity.

Opaque thick-film substrate made with CoorsTek technical ceramics.

Opaque Thick-Film Substrates

For light-sensitive semiconductor device applications, use CoorsTek opaque ADOS-90R alumina material — formulated specifically to block light transmittance and absorb stray light.

Substrate Size and Thickness

Substrate Thickness (alumina)

CoorsTek offers thick-film substrate thicknesses from 0.381 mm (0.015") to 2.54 mm (0.100"). The most common and economical thicknesses range from 0.635 mm (0.025") to 1.016 mm (0.040"). Minimum hole diameters are based on thickness.

Substrate Thickness      Minimum Hole Diameter     
0.635 - 0.889 mm
(0.025" - 0.035")
0.381 mm
0.914 - 1.524 mm
(0.036" - 0.060")
0.508 mm
 1.549 - 2.032 mm
(0.061" - 0.080")
0.635 mm


Substrate Size (Alumina)

CoorsTek offers a wide range of standard and common sizes. Contact us if you need a larger size or complex geometry.


Standard Sizes          
114.3 x 114.3 mm (4.5" x 4.5")
114.3 x 165.2 mm (4.5" x 6.5")
127.0 x 177.8 mm (5.0" x 7.0")
139.7 x 165.2 mm (5.5" x 6.5")
139.7 x 190.5 mm (5.5" x 7.5")

Laser Machining

Typical laser chart used for microelectronic applications.

CoorsTek provides a wide range of laser machining, profiling, drilling, scribing, and annealing services so your substrates fit just what you need in your application. We provide design consultation, rapid prototyping, and expedited deliveries. 

Laser Scribing

Illustration of a side laser scribed substrate for microelectronic applications.

CoorsTek offers special differential scribing to enhance preferential singulation. By varying the laser pulse spacing and depth in the (x) and (y) scribe directions, the sequence of singulation is controlled more precisely. Enhanced laser scribing helps prevent hooking, chipping, and premature breakage — improving process yields. Our Design Guide provides typical scribe line configurations and tolerances. 

Edge Finishing

CoorsTek offers a variety of edge finishing treatments:

  • Laser scribed & laser machined substrates
  • SmoothEdge™ substrates
  • SilkEdge™ substrates

Edge finishing treatment availability is geometry dependent. Contact a CoorsTek representative for availability of specific edge finishing treatments. 

Laser Scribed Edge

Laser scribed edge finish using CoorsTek technical ceramics.


Laser edge substrate using CoorsTek alumina for microelectronic applications.

SilkEdge™ Substrates

Laser edge finish using CoorsTek technical ceramic material for microelectronic applications.