CoorsTek is your partner for enabling innovations in semiconductor processing. Our broad portfolio of semiconductor grade materials, component production capabilities, and application engineering services help you solve big challenges. Engineered technical ceramics are used in the semiconductor industry because of their excellent material properties. Our ultra-pure ceramics are often used in the whole cycle of semiconductor manufacturing and semiconductor fabrication.
See how our solutions can help you innovate with components that last longer, reduce cycle times, and improve yields.
Semiconductor deposition processes use a combination of volatile precursor gases, plasma, and high temperature to layer high quality thin films onto wafers. Deposition chambers and wafer handling tools need durable ceramic components to stand up to these challenging environments.
CoorsTek provides custom engineered OEM components for:
- Chemical Vapor Deposition (CVD)
- Physical Vapor Deposition (PVD)
- Electrochemical Plating / Electrochemical Deposition (ECP, ECD)
- Atomic Layer Deposition (ALD)
Looking for more information on the properties of technical ceramics? Download, our eBook Ceramics: The Powerhouse of Advanced Materials for data charts and more.
ETCH PROCESS COMPONENTS
CoorsTek advanced, high-purity ceramic components are built to withstand the extreme environments in plasma etch (or "dry" etch) chambers — including vapor phase chemical etchants, high voltage RF (radio frequency) and microwave plasma, volatile byproducts, and aggressive cleaning cycles.
A View to a Kiln
Ready to learn more? Download our most recent eBook on our methods and processes, A View to a Kiln.
LITHOGRAPHY & WAFER INSPECTION
Perfect for next-generation lithography and wafer-handling applications, our ultra-pure ceramic components ensure minimal contamination and provide exceptionally long-life performance.
From precision air bearing components and beams to ultra-flat vacuum chucks and thermally stable pins, screws, and frames, advanced ceramic components are engineered for the demanding requirements and delicate nature of ion implant processes. CoorsTek provides advanced, RF-transparent ceramic components for high-performance ion implant equipment.
DIFFUSION & LPCVD PROCESSING
Traditional diffusion, low pressure chemical vapor deposition (LPCVD), and other batch semiconductor applications require the thermal and purity properties of advanced ceramics. CoorsTek provides engineered ceramics components specifically designed for batch diffusion and LPCVD requirements.
Wafer carriers used in epitaxial growth processing must endure high temperatures and harsh chemical cleaning. CoorsTek Clear Carbon™ susceptors are engineered specifically for these demanding epitaxy equipment applications. Their high-purity silicon carbide (SiC) coated graphite construction provides superior heat resistance, even thermal uniformity for consistent epi layer thickness and resistance, and durable chemical resistance. Fine SiC crystal coating provides a clean, smooth surface, critical for handling since pristine wafers contact the susceptor at many points across their entire area.
RAPID THERMAL PROCESSING
Technical ceramics are a natural choice for semiconductor thermal processing applications including rapid thermal processing (RTP), epitaxial, diffusion, oxidation, and annealing.
Chemical Mechanical Planarization (CMP) wafer polishing tables and plates require strong abrasion, corrosion resistance, and extreme stiffness to produce pristine flat, polished surfaces. CoorsTek CeraSiC and UltraSiC™ Direct Sintered Silicon Carbide (SiC) components deliver this high performance for CMP polishing tables, plates, and other critical components for semiconductor and flat panel display applications.
GENERAL APPLICATIONS & WAFER HANDLING
Your partner for custom advanced ceramic components and assemblies to support higher throughput and better yields in your semiconductor processing equipment. Our materials experts are ready to work with you to develop the optimal solution for your wafer handling, heating, and processing requirements.