High Temp Processing
Ceramic Components for High-Temperature Semiconductor Processing
Rapid Thermal Processing & Epitaxial Process Components
Technical ceramics are a natural choice for semiconductor thermal processing applications including RTP (Rapid Thermal Processing), Epi (Epitaxial), diffusion, oxidation, and annealing. CoorsTek provides advanced material components specifically designed to withstand thermal shocks with high-purity, sturdy, repeatable performance for high-temperature, processes including:
CoorsTek delivers expert material and design assistance to engineer custom components for all kinds of thermal processing - with materials that can withstand the thermal shock and rigors of the environment. Here are some examples of semiconductor thermal processing components that benefit from the use of engineered ceramics:
Recommended RTP & EPI Materials
Ceramic insulators combine strong dielectric properties with thermal stability and corrosion resistance.
Susceptors hold and heat semiconductor wafers during thermal processing. A susceptor is made of a material which absorbs energy by induction, conduction, and/or radiation and heats the wafer. Its thermal shock resistance, thermal conductivity, and purity are critical to rapid thermal processing (RTP). Silicon carbide coated graphite, silicon carbide (SiC), and silicon (Si) are commonly used for susceptors depending on the specific thermal and chemical environment. PureSiC® CVD SiC and ClearCarbon™ ultra-pure material which delivers superior thermal stability, corrosion resistance, and durability.