Boron Carbide
Family Overview
Boron carbide (B4C) is one of the world's hardest manufactured materials. Its strong chemical bonds and hard surface minimize wear in rigorous environments. Boron carbides are often used in ballistic armor, taking advantage of exceptional hardness and low density. The hardness provides excellent protection, while the light-weight maximizes mobility. Additionally, the uniquely structured boron carbide can be used for neutron shielding.
- Low density
- Exceptional hardness
- Neutron absorbing
Reaction Bonded Boron Carbide
Reaction bonded boron carbide (B4C) is primarily used ballistic armor, providing excellent protection while reducing weight as compared to other armor materials.
Hot Pressed Boron Carbide
Hot-pressed, also known as pressure assisted densified (PAD), boron carbide is one of the hardest materials available in commercial shapes. This exceptional hardness combined with low density is used in ballistic armor, maximizing protection while minimizing weight.
Sintered Boron Carbide
Pressureless sintered boron carbide combines high purity and the excellent mechanical properties of boron carbide for use in both ballistic armor and semiconductor manufacturing.
Ceramic Expertise
CoorsTek has a dedicated team tasked with helping create armor solutions in addition to decades of boron carbide manufacturing experience.
| Properties | Units | Reaction Bonded Boron Carbide |
Hot Pressed Boron Carbide |
Sintered Boron Carbide |
| Flexural Strength, MOR (20 °C) | MPa | 250 | 320 - 450 | 450 |
| Fracture Toughness, KIc | MPa m1/2 | 3.0 - 4.0 | 3.0 - 4.0 | 3.0 - 5.0 |
|
Thermal Conductivity (20 °C) |
W/m K | 50 | 45 - 100 | 43 - 100 |
| Coefficient of Thermal Expansion | 1x10-6/°C | 4.5 | 4.5 - 4.9 | 4.5 - 4.9 |
| Maximum Use Temperature | °C | 1000 | 2000 | — |
| Dielectric Strength (6.35mm) | ac-kV/mm | — | — | — |
| Dielectric Loss (tan δ) | 1MHz, 25 °C | — | — | — |
| Volume Resistivity (25°C) | Ω-cm | 10³ | 100 | 10 |