Direct Sintered Aluminum Nitride

Composition

AlN

View All Aluminum Nitride

direct sintered aluminum nitride overview

Direct sintered aluminum nitride is used in applications requiring high thermal conductivity and electrical resistivity with extreme temperature fluctuation, like high-intensity discharge lighting.

Example Applications

Substrates for LEDs and power electronics
Semiconductor manufacturing components

CoorsTek Formulations

Contact a CoorsTek expert to discuss custom solutions manufactured from Direct Sintered Aluminum Nitride.

Property	Units	Value
Flexural Strength, MOR (20 °C)	MPa	260 - 375
Fracture Toughness, K_Ic	MPa m^1/2	3.0 - 3.6
Thermal Conductivity (20 °C)	W/m K	80 - 205
Coefficient of Thermal Expansion	1 x 10^-6/°C	5.2 - 5.6
Maximum Use Temperature	°C	-
Dielectric Strength (6.35mm)	ac-kV/mm	15 - 25
Dielectric Loss (tan δ)	1MHz, 25 °C	0.0002 - 0.0077
Volume Resistivity (25°C)	Ω-cm	10¹¹ to 10¹⁴

The information provided on this chart is for general material property reference only. The customer should recognize that exact properties of materials may vary according to product configuration but close control of values of most properties can be maintained, if specified. Nothing herein is provided, or is to be construed, as absolute engineering data or constituting a warranty or representation. Contact CoorsTek for cost-effective design, development and manufacturing assistance. CoorsTek has 300+ variations including various forming and firing processes, not all variants are represented in the present website.

Direct Sintered Aluminum Nitride

direct sintered aluminum nitride overview

CONNECT WITH COORSTEK

Phone

Regional