Hot Pressed Aluminum Nitride
Composition
AlN
hot pressed aluminum nitride overview
Hot pressed aluminum nitride (AlN) is used in applications requiring high electrical resistivity in additional to exceptional thermal conductivity. The applications for hot pressed AlN typically involve rigorous or abrasive environments and high-temperature thermal cycling.
Example Applications
- Semiconductor heaters
CoorsTek Formulations
Contact a CoorsTek expert to choose a Hot Pressed Aluminum Nitride solution for your application.
| Property | Units | Value |
|---|---|---|
Flexural Strength, MOR (20 °C) |
MPa |
300 - 460 |
Fracture Toughness, KIc |
MPa m1/2 |
2.75 - 6.0 |
Thermal Conductivity (20 °C) |
W/m K |
80 - 100 |
Coefficient of Thermal Expansion |
1 x 10-6/°C |
3.3 - 5.5 |
Maximum Use Temperature |
°C |
800 |
Dielectric Strength (6.35mm) |
ac-kV/mm |
16.0 - 19.7 |
Dielectric Loss (tan δ) |
1MHz, 25 °C |
1 x 10-4 to 5 x 10-4 |
Volume Resistivity (25°C) |
Ω-cm |
1013 to 1014 |
The information provided on this chart is for general material property reference only. The customer should recognize that exact properties of materials may vary according to product configuration but close control of values of most properties can be maintained, if specified. Nothing herein is provided, or is to be construed, as absolute engineering data or constituting a warranty or representation. Contact CoorsTek for cost-effective design, development and manufacturing assistance. CoorsTek has 300+ variations including various forming and firing processes, not all variants are represented in the present website.
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