Hot Pressed Silicon Nitride
Composition
Si3N4
HOT PRESSED SILICON NITRIDE OVERVIEW
By hot pressing silicon nitride, one can achieve nearly zero-porosity. This leads to the exceptional mechanical properties as well as corrosion resistance even in high-temperature applications.
Example Applications
- Ball bearing components
- Check valves
CoorsTek Formulations
Contact a CoorsTek expert to discuss custom solutions manufactured from Hot Pressed Silicon Nitride.
| Property | Units | Value |
|---|---|---|
Flexural Strength, MOR (20 °C) |
MPa |
640 - 1000 |
Fracture Toughness, KIc |
MPa m1/2 |
4.25 - 6.5 |
Thermal Conductivity (20 °C) |
W/m K |
20 - 100 |
Coefficient of Thermal Expansion |
1 x 10-6/°C |
2.9 - 4.5 |
Maximum Use Temperature |
°C |
1400 |
Dielectric Strength (6.35mm) |
ac-kV/mm |
17.7 |
Dielectric Loss (tan δ) |
1MHz, 25 °C |
10-4 |
Volume Resistivity (25°C) |
Ω-cm |
1014 |
The information provided on this chart is for general material property reference only. The customer should recognize that exact properties of materials may vary according to product configuration but close control of values of most properties can be maintained, if specified. Nothing herein is provided, or is to be construed, as absolute engineering data or constituting a warranty or representation. Contact CoorsTek for cost-effective design, development and manufacturing assistance. CoorsTek has 300+ variations including various forming and firing processes, not all variants are represented in the present website.
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