Global Technical Ceramics Leader CoorsTek Features Semiconductor Processing and Packaging Components at Semicon West 2018
July 08 2018
Innovative CoorsTek ceramic components are engineered to improve yield, increase throughput, and enable smarter devices
Golden, Colorado, USA ─ CoorsTek, the world’s leading technical ceramics manufacturer, visits SEMICON West 2018 this week in San Francisco to showcase its semiconductor-grade components for fabrication, packaging, and electronics OEMs. Advanced ceramics, which outperform conventional polymers and metals, are some of the only materials which can endure the harsh demands of semiconductor processing’s aggressive combination of chemistries, temperatures, precision, and cleanliness.
“As the design and processing of semiconductor ICs continues to scale — in density, power, and performance — the impact of materials becomes even more critical,” explains Patty Mishic, Chief Commercial Officer at CoorsTek. “Our experts collaborate with leading semiconductor processing equipment companies around the world to engineer advanced ceramic components which help improve their yields, increase throughput, and enable smarter devices. It is an exciting place and time we are all in — artificial intelligence, autonomous vehicles, all kinds of new ways to make our world measurably better.”
CoorsTek ceramics are engineered to support virtually every step of the semiconductor manufacturing process, from wafer processing to device fabrication and packaging. The company will focus on some of its most advanced ceramic materials at SEMICON West 2018 including:
PureSiC™– a family of 99.9995% pure silicon carbides specifically designed for extreme temperature and corrosion resistance, available in a range of high, medium, and low resistivity and transmissivity grades
Exyria™- yttria engineered for superior plasma resistance and purity for high performance plasma etch applications
GatorGrip™– aggressive micro-textured finishes on tough CZRy™composite ceramics designed to extend life and improve bond strength in thermosonic wire bonding
Learn more by visiting CoorsTek in booth # 5848 (North Hall) at the Moscone Center in San Francisco from July 10-12, 2018, or visitcoorstek.com.