Custom Electronic Components
Precision Ceramic Components for Microelectronic Applications
Ceramic microelectronic components are used in active and passive devices that enable high-performance electronics to be used in all kinds of environments and applications — in aerospace, automotive, communications, computers, medical, and a large variety of electronic instruments, industrial equipment, and consumer appliances.
Here are just a few examples of how advanced ceramics are used in resistors, capacitors, hybrid circuits, sensors, and other critical microelectronic devices.
Many technical ceramics are inherently strong electrical insulators. CoorsTek provides a wide range of electrical insulator components in various shapes, sizes, and form factors — providing high electrical resistivity, dielectric strength, and other application-specific requirements.
Aluminum Nitride Insulators
Aluminum nitride (AlN) has a very high thermal conductivity, allowing this unique ceramic to spread and get rid of heat quickly. This allows electronic components to maintain cooler operating temperatures while still providing the excellent electrical insulation of ceramic insulators.
CoorsTek provides custom ceramic-to-metal feedthrough assemblies for passing energy or materials between the outside and inside of hermetically-sealed chambers. These feedthroughs combine electrical insulation with vacuum-tight performance —and are engineered to withstand harsh conditions like high or cryogenic temperatures, high pressure or vacuum, and aggressive chemicals.
CoorsTek ThermTile™ ceramic heat sinks and electrical insulators are an optimum choice when thermal management is important — combining the benefits of strong ceramic tiles, good thermal conductivity, and phase-change materials to improve heat transfer from power electronics and other heat-generating devices.
CoorsTek ceramic fuse bodies deliver robust dielectric strength, high resistivity, and durability for industrial and commercial-grade fuses.
Epoxy Seal Lids
CoorsTek ceramic epoxy seal lids are prepared for B-stage epoxies with rapid cure cycles —delivering high-strength, moisture-resistant seals for electronic and pressure-sensitive devices. Our epoxy seal has excellent fillet formation characteristics, and the high post-cure thermal and moisture resistance needed for high-reliability electronic packages.
Metallized Electronic Components
CoorsTek supplies custom metallized ceramic components and assemblies, with metal-to-ceramic joints of exceptional strength, durability, and hermeticity.
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