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Semiconductor Packaging (back end)

Precision Ceramic Bonding Tools from the Inventor of the Ceramic Capillary

*CoorsTek Gaiser products have been discontinued. Final orders must be placed by September 13, 2019.

 

CoorsTek Gaiser® precision wire bonding tools represent decades of material and design refinement recognized by users all over the world. We invented the ceramic capillary and continue to lead the semiconductor packaging market with innovative, high durability designs and unparalleled support services to ensure your wire bonding processes are as trouble free as possible.

In addition to providing traditional wire bonding tools for back-end semiconductor processing, Gaiser tools offers custom specialty micromachining for ultra-hard materials. Learn more

For a complete Gaiser Precision Bonding Tools catalog, call +1 805 644 5583 or email gaiser@coorstek.com 

Related Links

Presentation:
Ceramic Solutions Enabling the Evolution of Semiconductor Processing, Ceramics Expo 2018

Article:
Ceramic Industry: Semiconductor-Grade Ceramics Enable Future ElectronicsJune 2017


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