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Semicon West 2018

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Booth Location and Map 

How to Find Us:

Booth # 5848, North Hall

Moscone Center Address:

747 Howard Street
San Francisco, CA 94013 

Show Dates and Times:

Tuesday, July 10:      10:00 am - 5:00 pm
Wednesday, July 11: 10:00 am - 5:00 pm
Thursday, July 12:     10:00 am - 4:00 pm

Technical Program
Smart Transportation | Smart Workforce

Transportation:

Public transportation | Silicon Valley Shuttle (free)

CoorsTek Semiconductor Processing Components at Semicon West 2018

CoorsTek semiconductor processing components help improve fabrication yields and throughput - combining ultra-pure, particle- and contaminant-free materials with extreme thermal, chemical, mechanical, and electrical performance. Our engineered ceramics help enable the production of ever faster, smarter devices. We work with our customers to provide custom, application-specific solutions for semiconductor processing and packaging.

Visit CoorsTek at the upcoming Semicon West 2018 show in San Franciso, California to learn more about how our engineered ceramic components can enhance your processing equipment including:

  • Deposition
  • Etch
  • Lithography
  • Wafer processing & handling
  • Wire bonding & packaging 
  • Custom OEM components

Get a discounted pass. 

As a CoorsTek guest, you receive the lowest available rates for Semicon West. Come exchange ideas, advance the science, broaden your technical expertise - and help move our industry beyond smart.

Register now for your discounted pass. 

CoorsTek engineered ceramics help improve yield, increase throughput & enable smarter devices. Come see how in booth 5848.


What if you could improve your yields? Increase your throughput? Extend the mean time between cleaning (MTBC) for your process?
CoorsTek semiconductor-grade ceramics endure harsh process conditions - like plasma, thermal shock, and corrosive gases and chemicals - all while reducing particles and contaminants.

 

Increase yields & throughput in semi processing equipment. 

CoorsTek ceramic components are engineered to provide cleaner processing with lower defect rates, delivering higher uniformity and reliability through the toughest chamber environments.

image-semi-wafer-chuck
Improve bond strength & reliability in back-end packaging.

CoorsTek Gaiser Precision Bonding Tools provide unmatched thermosonic bond strength and useful life. Our advanced materials and proven designs deliver the packaging reliability.your customers demand. 

Enable next-generation technology. 

ALD, ALE, 3D NAND, DRAM, and beyond - CoorsTek collaborates with OEM partners to help meet your toughest challenges. As the ceramic materials experts, CoorsTek works with you from concept through scalable production.

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ADDITIONAL RESOURCES

Brochures |
Semiconductor Fabrication

Semiconductor Ceramics | Application Guide

Brochure | 
Semiconductor Packaging
brochure-image-Gaiser-GatorGrip-Capillaries

Gaiser GatorGrip | Wire Bond Capillaries

Video | CoorsTek Center for Advanced Materials

 

 

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