Thick-Film Electronic Substrates
Ceramic Substrates for Thick-Film Electronics
CoorsTek developed the standards for thick-film ceramic substrates and continues to provide economical yet durable substrates for hybrid integrated circuits, surface mount devices, sensors, and other thick-film electronics. We help you design a thick-film ceramic substrate tailored to your application:
- Material selection
- Size & thickness
- Laser machining & scribing
- Edge finishing
- Inspection & special requirements
Why Ceramic Thick-Film Substrates?
Alumina is the material of choice for most thick-film ceramic substrates — delivering durable, cost-effective performance for hybrid electronic circuits with proven reliability. CoorsTek has engineered different grades, formulations, and thicknesses to provide an optimal fit for a variety of applications.
Aluminum nitride (AlN) thick-film substrates are ideal when you need improved thermal management. CoorsTek aluminum nitride thick-film substrates exhibit a thermal conductivity 4-6 times higher than alumina substrates, drawing heat away from high-brightness LEDs, power electronics or other devices to help them run cooler, better, and longer.
Alumina Thick-Film Substrates
CoorsTek ADS-96R thick-film alumina substrates are the standard, particularly well suited for small-geometry, high-resistance circuitry — engineered to minimize resistivity variation and maximize aged adhesion.
DuraStrate™ Thick-Film Substrates
DuraStrate thick-film substrates use exclusive CoorsTek ADSR-96R fine-grained alumina which delivers a >20% increase in strength — particularly useful for substrates 0.5 mm (0.020") or thinner.
Aluminum Nitride Thick-Film Substrates
CoorsTek aluminum nitride (AlN) thick-film substrates deliver improved thermal management, drawing heat away from LEDs, power electronics, and other high-power devices - delivering 4-6x higher thermal conductivity than alumina.
CoorsTek MidFilm substrates are compatible with etchable inks and photo-formed systems — combining high flexural strength and thermal conductivity.
Opaque Thick-Film Substrates
For light-sensitive semiconductor device applications, use CoorsTek opaque ADOS-90R alumina material — formulated specifically to block light transmittance and absorb stray light.
Substrate Size and Thickness
Substrate Thickness (alumina)
CoorsTek offers thick-film substrate thicknesses from 0.254 mm (0.010") to 3.556 mm (0.140"). The most common and economical thicknesses range from 0.635 mm (0.025") to 1.0 mm (0.040"). Minimum hole diameters are based on thickness.
|Substrate Thickness||Minimum Hole Diameter|
|0.635 - 0.889 mm
(0.025" - 0.035")
|0.914 - 1.524 mm
(0.036" - 0.060")
| 1.549 - 2.032 mm
(0.061" - 0.080")
Substrate Size (Alumina)
CoorsTek offers a wide range of standard and custom sizes. Contact us if you need a larger size or complex geometry.
|88.9 x 88.9 mm||(3.5" x 3.5")|
|114.3 x 114.3 mm||(4.5" x 4.5")|
|114.3 x 165.2 mm||(4.5" x 6.5")|
|127.0 x 177.8 mm||(5.0" x 7.0")|
|139.7 x 165.2 mm||(5.5" x 6.5")|
|139.7 x 190.5 mm||(5.5" x 7.5")|
CoorsTek provides a wide range of laser machining, profiling, drilling, scribing, and annealing services so your substrates fit just what you need in your application. We provide design consultation, rapid prototyping, and expedited deliveries.
CoorsTek offers special differential scribing to enhance preferential singulation. By varying the laser pulse spacing and depth in the (x) and (y) scribe directions, the sequence of singulation is controlled more precisely. Enhanced laser scribing helps prevent hooking, chipping, and premature breakage — improving process yields. Our Design Guide provides typical scribe line configurations and tolerances.
CoorsTek offers a variety of edge finishing treatments:
- laser scribed & laser machined substrates
- SmoothEdge™ substrates
- SilkEdge™ substrates
Edge finishing treatment availability is geometry dependent. Contact your CoorsTek representative for availability of specific edge finishing treatments.
Laser Scribed Edge