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Semiconductor Packaging (back end)

Gaiser® Precision Bonding Tools

CoorsTek Gaiser® precision wire bonding tools represent decades of material and design refinement recognized by users all over the world. We invented the ceramic capillary and continue to lead the semiconductor packaging market with innovative, high durability designs and unparalleled support services to ensure your wire bonding processes are as trouble free as possible.

In addition to providing traditional wire bonding tools for back-end semiconductor processing, Gaiser tools offers custom specialty micromachining for ultra-hard materials. Learn more

For a complete Gaiser Precision Bonding Tools catalog, call +1 805 644 5583 or email gaiser@coorstek.com 

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