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Hot Pressed Boron Carbide

Composition

B4C

hot pressed boron carbide overview

Hot-pressed, also known as pressure assisted densified (PAD), boron carbide is one of the hardest materials available in commercial shapes. This exceptional hardness combined with low density is used in ballistic armor, maximizing protection while minimizing weight.

Example Applications

  • Semiconductor heaters
  • Substrates for LEDs and power electronics

 

CoorsTek Formulations

Contact a CoorsTek expert to choose a Hot Pressed Boron Carbide solution for your application.

Property Units Value

Flexural Strength, MOR (20 °C)

MPa

320 - 450

Fracture Toughness, KIc

MPa m1/2

3.0 - 4.0

Thermal Conductivity (20 °C)

W/m K

45 - 100

Coefficient of Thermal Expansion

1 x 10-6/°C

4.5 - 4.9

Maximum Use Temperature

°C

2000

Dielectric Strength (6.35mm)

ac-kV/mm

-

Dielectric Loss (tan δ)

1MHz, 25 °C

-

Volume Resistivity (25°C)

Ω-cm

100

The information provided on this chart is for general material property reference only.  The customer should recognize that exact properties of materials may vary according to product configuration but close control of values of most properties can be maintained, if specified. Nothing herein is provided, or is to be construed, as absolute engineering data or constituting a warranty or representation. Contact CoorsTek for cost-effective design, development and manufacturing assistance. CoorsTek has 300+ variations including various forming and firing processes, not all variants are represented in the present website.

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