Home

+1 303 271 7100

Contact

Hot Pressed Silicon Nitride

Composition

Si3N4

HOT PRESSED SILICON NITRIDE OVERVIEW

By hot pressing silicon nitride, one can achieve nearly zero-porosity. This leads to the exceptional mechanical properties as well as corrosion resistance even in high-temperature applications.

Example Applications

  • Ball bearing components
  • Check valves

 

CoorsTek Formulations

Contact a CoorsTek expert to choose a Hot Pressed Silicon Nitride solution for your application.

Property Units Value

Flexural Strength, MOR (20 °C)

MPa

640 - 1000

Fracture Toughness, KIc

MPa m1/2

4.25 - 6.5

Thermal Conductivity (20 °C)

W/m K

20 - 100

Coefficient of Thermal Expansion

1 x 10-6/°C

2.9 - 4.5

Maximum Use Temperature

°C

1400

Dielectric Strength (6.35mm)

ac-kV/mm

17.7

Dielectric Loss (tan δ)

1MHz, 25 °C

10-4

Volume Resistivity (25°C)

Ω-cm

1014

The information provided on this chart is for general material property reference only.  The customer should recognize that exact properties of materials may vary according to product configuration but close control of values of most properties can be maintained, if specified. Nothing herein is provided, or is to be construed, as absolute engineering data or constituting a warranty or representation. Contact CoorsTek for cost-effective design, development and manufacturing assistance. CoorsTek has 300+ variations including various forming and firing processes, not all variants are represented in the present website.

CONNECT WITH COORSTEK

Ask A Question

Thank you for contacting us.

Compare 0 materials