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Ceramic Finishing Capabilities

Ceramic Finishing

Brazing, Bonding, & Joining • Grinding, Lapping, & Polishing • Laser Machining • Metallization • Micromachining

CoorsTek provides a complete range of precision finishing options to make your technical ceramic component a functional part or assembly, including:

Shaping

  • CNC grinding
  • Laser machining
  • Cutting
  • Lapping & polishing
  • Laser finishing

SURFACE TREATMENT

  • Metallizing
  • Plating & glazing
  • Flame spraying
  • Plasma coating
  • CVD SiC coating
  • Texturing

Assembly

  • Brazing
  • Solder & epoxy
  • Adhesive bonding
  • Chemical treatment
  • Fasten & fit
  • Vacuum bonding

Specialized

  • Cleanroom assembly & packaging
  • Inspection & testing
  • Analytical lab measurement

Vacuum Interrupter

Brazing, bonding, & joining

Our experts help you select the optimal process option for durable and reliable ceramic-to-ceramic and ceramic-to-metal joining.

Structural Bonding
CoorsTek structural bonding provides custom design options not available with hard-facing or coatings, and is compatible with a large number of materials. By limiting the use of exotic materials to the important contact points, the cost and weight of your application is minimized.

CoorsTek uses numerous proprietary processes, with each step carefully monitored and tested. Often our bond strengths measure several times the strength advertised for a given epoxy.

Brazing
Brazing involves bonding metal to ceramic for structural purposes, creating a thin, uniform joint. CoorsTek brazes components for numerous applications, including power generation and optics.

Epoxy
CoorsTek offers B-stage epoxy sealing capability for lids, caps, covers, and frames. Epoxy seals combine high strength and moisture resistance, while frequently providing a more process-friendly, cost-effective option than brazing or soldering.

Advanced Assembly
From basic component manufacturing to advanced joining and subassembly, CoorsTek provides just the right level of assembly service integration for your project.

Example Brazing, Bonding, & Joining Applications

  • Antennas
  • Feed-Through Insulators
  • Headers
  • High-Power Receptacles
  • Hybrid Circuits
  • Insulator Rings and Cylinders
  • Insulating Disks
  • Micro-Ceramic Components
  • Power Grid Tubes
  • Power Switches
  • Sensors
  • Traveling Wave Tubes
  • Vacuum Interrupters
  • Windows
  • X-Ray Tubes

 

Grinding, Lapping, & polishing

Advanced Substrate Lapping & Polishing Services

CoorsTek provides secondary diamond head lapping and polishing down to ±12.7 µm (0.0005 inch over inch) surface flatness — critical for your most precise applications, such as accommodating the finest, most demanding hybrid circuit paths imaginable. 

Grinding Media
Lasered Substrate

Laser machining & FINISHING

CoorsTek owns and operates large banks of high-power lasers specifically engineered for technical ceramic machining, finishing, and edging — delivering the most precise, efficient, and reliable laser machined ceramic components available.

metallization

Whether you are adding an electronic circuit path to one of our high-purity substrates or joining a metal component with ceramic, CoorsTek experts help engineer a customized solution with the most reliable and cost-effective method and material. Some example applications include:

  • Antennas
  • Feed-Through Insulators
  • Power Grid Tubes
  • Vacuum Interrupters
  • X-ray Tubes
Metallized Component
Micro-Machined Component

Micromachining

CoorsTek excels at producing custom core geometries and complex configurations in ultra-hard materials, including:

  • Small hole drilling to 20 µm 
  • Wire and sinker (ram) micro EDM
  • CNC Machining
  • Fine grinding & polishing
  • Swiss screw machining 

Medical Applications

  • Biopsy tools
  • Laser shields
  • Precision guides
  • Custom electrodes
  • Cutter tools

Semiconductor Applications

  • Front end semiconductor processing
  • Back end semiconductor packaging 

Automotive Applications

  • Fuel injection systems

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